Подпружиненный термопарный зонд
1. Использование & Функции
It’s an industrial temperature sensor designed to measure the surface temperature of solid objects/equipment accurately by using spring pressure to press the probe tightly against the measured surface. It converts temperature signals into electrical signals, enabling temperature display, control, or recording when paired with instruments.
2. Функции
- Structure: Composed of a temperature probe, compression spring, and metal braided sheath (compact probe, retractable spring).
- Installation: No complex fixing required; the spring’s elasticity ensures tight contact with uneven/dynamic surfaces.
- Response: Large probe contact area enables fast heat conduction, with a temperature response time ≤ 1 second (for most models).
3. Преимущества
- High Accuracy: Spring pressure reduces “contact thermal resistance,” with a measurement error as low as ±0.5℃.
- Environmental Adaptability: The metal sheath is vibration-resistant and corrosion-resistant, working stably in environments ranging from -50℃ to +800℃ (for specific models).
- Гибкость: Small size and bendable design make it suitable for narrow spaces or frequent disassembly scenarios.
4. Ключевые атрибуты
- Температурная диапазон: Typically -50℃ ~ +600℃ (extendable to +800℃ with special materials).
- Thermocouple Type: Общие типы: K-type (high versatility) & J-type (high precision in low-temperature ranges).
- Sheath Material: Stainless steel braided mesh (wear-resistant & anti-interference).
- Spring Pressure: Usually 5~15N (ensures tight contact without damaging the measured surface).
5. Сценарии применения
- Plastics/Injection Molding Industry: Embedded in mold cavities to monitor molten plastic temperature and optimize molding processes.
- Textile/Food Industry: Measures surface temperatures of drying cylinders, печи, and rollers to ensure uniform product heating.
- Mechanical/Energy Industry: Monitors temperatures of bearings, pipes, and reactors to prevent equipment overheating failures.
- Electronics Industry: Tests operating temperatures of circuit boards and semiconductor components to assist in heat dissipation design.
This product is a “flexible workhorse” for industrial temperature monitoring, balancing adaptability to complex working conditions and high measurement precision.
